| Data set information | |
| Name | Plating |
| Synonyms | up plating; brush/selective plating; electroplating; electroless plating,电镀产品（电子元器件、线路板除外） |
| Classification |
Class name
:
Hierarchy level
No records found. |
| General comment | Plating on a PCB refers to the electrochemical process by which a metal is deposited onto the surface of the circuit board, and inside the plated through-holes. The most common plated metal in PCB fabrication is copper. Copper plating serves two purposes, it increases the copper thickness of the surface pads and conductors. This plating technique is ideal for prototype and small-scale production runs as it is a simple process that does not require specialized equipment or multiple applications. |
| Quantitative reference | |
| Reference Flow Property | |
| LCI method | |
| Type of flow | Product flow |
| Data entry by | |
| Time stamp (last saved) | 2024-01-03T16:03:40.971785+08:00 |
| Data set format(s) | |
| Publication and ownership | |
| UUID | 738eaa80-9b74-4afe-b36a-4703365e5009 |
| Data set version | 01.00.000 |
| Flow Property | Mean value | Minimum value | Maximum value | Uncertainty distribution type | Relative StdDev in % | Data derivation type / status | General comment |
|---|---|---|---|---|---|---|---|
| 1.0 | 0.0 | 0.0 | 0.0 % |