| Data set information | |
| Name | Silver Paste |
| Synonyms | Silver Conductive Paste; Silver Sintering Paste |
| Classification |
Class name
:
Hierarchy level
No records found. |
| Sum Formula | Ag |
| General comment | Silver conductive paste (Ag) is an adhesive used on indium tin oxide (ITO) for various electronic applications. It can also be used as an interdigitated electrode (IDE) for gas sensors and in material extrusion 3D printing techniques. It is produced for use in thin film crystalline solar cells, anti-reflective coatings, and other applications. Silver sintering paste is a conductive material used for bonding electronic components and creating electrical connections in various applications. |
| Quantitative reference | |
| Reference Flow Property | |
| LCI method | |
| Type of flow | Product flow |
| Data entry by | |
| Time stamp (last saved) | 2024-04-16T19:00:21.847800+08:00 |
| Data set format(s) | |
| Publication and ownership | |
| UUID | 8c8d16cc-a62a-4a7a-b8c2-209c5eb38b6c |
| Data set version | 00.01.005 |
| Flow Property | Mean value | Minimum value | Maximum value | Uncertainty distribution type | Relative StdDev in % | Data derivation type / status | General comment |
|---|---|---|---|---|---|---|---|
| 1.0 | 0.0 | 0.0 | 0.0 % |